US researchers said that they use carbon nanotubes instead of silicon as the raw material, allowing memory and processors to be stacked in three-dimensions, which reduces the time between data and greatly improves the processing speed of computer chips. The speed of the 3D chip developed by the method may reach 1,000 times that of the current chip. One of the researchers, Scarborough University's Ph.D. candidate for electronics engineering, Max Schalker, explained that the “stumbling block†that hinders the speed of computers is that data is switching back and forth between processor and memory, which consumes a lot of time and energy. However, it is very tricky to solve this problem. The memory and the central processor (CPU) cannot be placed on the same wafer because the silicon wafer must be heated to around 1000 degrees Celsius; and many metal components in the hardware are melted at this high temperature. For this reason, Sharakel and his mentor, Sabhath Mitra, have turned their attention to carbon nanotubes. Sharkell said that carbon nanotubes are light-weight and have a perfect hexagonal connection. They can be processed at low temperatures. Compared with conventional transistors, carbon nanotubes are smaller, more conductive, and can support fast switching. Its performance and energy consumption far outperform traditional silicon materials. However, using carbon nanotubes to make chips is not easy. First, the growth pattern of carbon nanotubes is very poorly controlled; second, the presence of a small amount of metallic carbon nanotubes can impair the performance of the entire chip. The researchers tried to solve these problems and created the world’s first carbon nanotube computer in 2013. However, this computer is both slow and heavy and has only a few transistors. Now, researchers have taken a step further and developed a method for stacking layers of memory and transistors. The new 3D design method drastically reduces the "commuting" time of data back and forth between transistors and memory, and the calculation speed of new structures. 1000 times that of existing chips. Moreover, the research team also used the new chip architecture to develop multiple sensor wafers that can be used to detect infrared, specific chemical substances, and so on. Next, they plan to upgrade the system to make larger and more complex chips. (Reporter Liu Xia) Micro Fiber Roller Cover,Micro Plush Roller,Microfiber Roller Cover,Microfiber Paint Roller Ningbo Beilun Gelei Plastic Parts Co.,Ltd , https://www.paintwelltools.com