November 16, 2024

Seco tool hole processing new concept (4)

Precifix reamer

1 boring

Like reaming, boring can expand a hole that has been drilled or cast. However, boring covers a wider range of sizes, and the diameter of the machined hole can range from less than 1 mm up to several meters. It offers greater flexibility and can compensate for large part differences. An adjustable boring head can be used for different apertures and tolerances, making boring the best choice for small machine shops. Boring can also be used for very rough holes or for minor deviations in the correction holes. Because of the high productivity in expanding the aperture, roughing is an ideal choice for customers who want a good metal removal rate. Seco's rough head series also straightens the geometry of the hole and improves the shape accuracy of the hole. Fine is a good choice for high standard tolerances, hole accuracy and perfect surface finish. The initial cost of boring is higher compared to reaming because it requires investing in new tools.

The Graflex modular boring system provides a high-strength and precise patented connection interface. It can be used to build modular tools of almost any size and length. Consisting of a wide range of interchangeable standard tool parts, Graflex can be quickly and easily combined into the tools needed for boring, milling, drilling, tapping and even turning applications. This system can be used to meet non-standard tooling requirements and standard tooling applications with a wider range of versatility.

The AxiaBore fine boring head range covers diameters from 0.3mm (Nanobore) to 108mm (AxiaBorePlus with MPA). Due to a new cylindrical and flange design, the AxiaBore range is 30% more rigid than its predecessor. This allows it to use higher processing parameters to increase productivity. In addition, an indirect barrel lock (patented IBL system) simplifies tool setting and the set diameter is no longer affected by the locking screw.

Seco Tools is undergoing hole machining

2 Simplify the processing

Seco's complete hole machining solution allows customers to obtain high quality finished holes with a single resource, or even a metal cutting solution for finished parts. Seco's global manufacturing base works closely with not only the processing of individual parts, but also the entire application and the development of complementary tools. Due to the large production time required for hole machining, Seco's complete service solutions for drilling, reaming and boring help customers simplify contact, procurement, warehousing, technical support, consulting and process solutions, reducing the cost per hole. For the processing of mass production, batch parts or difficult-to-machine materials, a complete set of hole machining solutions based on customer-specific objectives is available.

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Xinlongwei Chem offers the broadest line of semiconductor-grade wet chemicals in North America. We also supply major technology customers in Europe, the Middle East and Asia. With purities that extend to the parts-per-trillon (ppt) level, our high-quality acids and bases are used for cleaning formulations and other processes by semiconductor and wafer fabs throughout the world.

As the complexity of semiconductor silicon wafers continues to advance, so too must the purity of the process chemicals used in their manufacture. Xinlongwei chem is proud to be a leading supplier of high purity process chemicals for many of the world`s leading technology companies.


 

 


 

 

 

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